| 摘要 |
PROBLEM TO BE SOLVED: To provide an assembled printed wiring board capable of suppressing an occurrence of warping in manufacturing a thin printed wiring board. SOLUTION: The assembled printed wiring board is formed by coupling a plurality of individual printed wiring boards, and in the assembled printed wiring board, a dummy circuit is provided on the inside or outside of the individual printed wiring board for equalizing a remaining copper rate on the conductor face of the inside or outside of the individual printed wiring board. COPYRIGHT: (C)2007,JPO&INPIT
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