| 摘要 |
PROBLEM TO BE SOLVED: To form a wiring layer or a via in which the generation of voids in a plating layer is suppressed when copper electroplating is performed to a trench or a via hole with a high aspect ratio formed at an insulating layer. SOLUTION: A film containing an additive accelerating electroplating is selectively formed on the bottom face part of a trench or a via hole, and then, copper electroplating is performed. The plating acceleration additive-containing film at the bottom face part is formed by performing aeration as an opening board for plating formation is dipped into a plating acceleration additive-containing solution, so as to remove bubbles in the opening part, and thereafter performing a spin rinsing process and drying treatment. COPYRIGHT: (C)2007,JPO&INPIT
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