| 摘要 |
PROBLEM TO BE SOLVED: To provide a barrel plating apparatus and the like capable of increasing a plating amount in the plating of compact electronic components. SOLUTION: The barrel plating apparatus is provided with a barrel 3 supported to rotate by a supporting means 7 and a conductive terminal 5 fixed to a disc-like end part 43 of a supporting body 11 positioned in the barrel 3, supported to be cantilevered to be extended into the barrel and for applying current to a material to be plated. The quantity of the material-to-be-plated entering into the barrel 3 is increased by extending the conductive terminal 5 from a position eccentric to the rotary axis CL of the barrel. COPYRIGHT: (C)2007,JPO&INPIT
|
