| 摘要 |
A wiring substrate to which a semiconductor element 10 is connected, is a wiring substrate 20 comprised of a glass substrate with through-hole groups 20 d, each group consisting of a plurality of through holes 20 c extending from input surface 20 a to output surface 20 b and formed in a predetermined array, and conductive members 21 formed on respective inner walls of the through holes 20 c in each through-hole group 20 d so as to establish electrical continuity between input surface 20 a and output surface 20 b. A bump electrode 12 of semiconductor element 10 connected to the input surface 20 a corresponds to each through-hole group 20 d, conductive member 21, and conductive part 22 formed in a region covering the through-hole group 20 d, and is connected so that a portion of the bump electrode 12 enters into an interior of each of the through holes 20 c. This provides a semiconductor device in which good connection is made between the semiconductor element and the corresponding conduction path in the wiring substrate, and a radiation detector using it.
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