| 摘要 |
<P>PROBLEM TO BE SOLVED: To surely insulate an interposer from the pattern of an antenna without interposing any insulating layer when joining the interposer to the antenna. <P>SOLUTION: In a non-contact type IC tag, an adhesive layer (5) is formed in either a base material (4) or a conductive layer (6) made of a metallic foil or an alloy film, and the conductive layer (6) is adhered across the adhesive layer (5) on one face of the base material (4), and an interposer (3) is joined to the opposite position of the conductive layer (6) on the other face of the base material (4), and the interposer (3) is electrically connected to the conductive layer (6). <P>COPYRIGHT: (C)2007,JPO&INPIT |
