| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor sealing epoxy resin composition excellent in both electrical reliability such as moisture-resistant reliability and curability. SOLUTION: The semiconductor sealing epoxy resin composition comprises (A) an epoxy resin, (B) a phenolic resin, and (C) a curing accelerator having two or more diarylphosphino groups in the molecule. COPYRIGHT: (C)2007,JPO&INPIT |
