发明名称 MOLDED OBJECT COOLING DEVICE AND METHOD FOR COOLING MOLDED OBJECT
摘要 PROBLEM TO BE SOLVED: To ensure the upgrading of the quality of a molded object. SOLUTION: This molded object cooling device has an internally formed cooling medium flow path, a cooling platen for loading a molded object to be unloaded from a mold assembly and a cooling medium supply source which supplies a cooling medium for cooling the loaded molded object. The cooling medium flow path is arranged so as to cool the molded object by differentiating the cooling mode locally. In this case, the cooling medium for cooling the loaded molded object, is supplied to the cooling platen. Consequently, even in case the density of the molded object is no longer uniform, and the density of the specified part is high and that of the other part is low, the molded object is prevented from becoming non-uniform in thickness and warped in the cooling process. Thus, the quality of the molded object is upgraded. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007083659(A) 申请公布日期 2007.04.05
申请号 JP20050277814 申请日期 2005.09.26
申请人 YUSHIN PRECISION EQUIPMENT CO LTD;SUMITOMO HEAVY IND LTD 发明人 KOKURYO HIDEKI;SAWAISHI HIROYUKI
分类号 B29C33/04;B29L17/00;G11B5/84 主分类号 B29C33/04
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