Semiconductor device having metallic lead and electronic device having lead frame

摘要

A semiconductor device includes: first to fourth vertical type semiconductor elements having first and second electrodes; a metallic lead; a resin mold; a circuit board; an electric circuit on the circuit board; and an electronic chip on the circuit board. The electronic chip drives and controls each semiconductor element through the electric circuit. The first to fourth semiconductor elements are arranged to be a stack construction in the resin mold. The first to fourth semiconductor elements provide a H-bridge circuit. Each of the first and second electrodes in each semiconductor element is directly connected to the metallic lead so that heat generated in the semiconductor element is radiated through the metallic lead.