发明名称 Arrangement for sealing of basement of building, has sealing sheet which consists of double layer construction and moisture-resisting sealing layer whereby building-up adhesive layer can be soldered by addition of heat
摘要 <p>Arrangement has a sealing sheet (01) which consists of double layered construction and moisture-resisting sealing layer (02) whereby adhesive layer (03) can be soldered by addition of heat. The sealing sheets overlap at a junction and are connected by soldering on adhesive layer.</p>
申请公布号 DE202006019005(U1) 申请公布日期 2007.04.05
申请号 DE20062019005U 申请日期 2006.12.14
申请人 WAGNER, RUEDIGER 发明人
分类号 E02D31/02;E04B1/64 主分类号 E02D31/02
代理机构 代理人
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