Verfahren zum schnellen Lösen einer Halbleiterscheibe von einem elektrostatischen Scheibenhalter mittels einer Hystereseschleife

摘要

A method for rapidly dechucking a wafer (114) from a chuck (106) by applying a voltage between the wafer and the electrode that performs a hysteretic discharge cycle such that residual charge is removed. The voltage is a decaying oscillating waveform that provides a decaying electric field at the wafer to chuck surface interface. The form of this field at this interface is very important to achieving rapid dechucking of less than 200 mS.