| 发明名称 |
INERTIAL BONDING METHOD OF FORMING A SPUTTERING TARGET ASSEMBLY AND ASSEMBLY MADE THEREFROM |
| 摘要 |
<p>A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method can include bonding a sputtering target to a backing plate with the use of solder, braze metal, or alloys thereof, and reflowing the solder or braze metal after bonding the sputtering target to the backing plate.</p> |
| 申请公布号 |
WO2007038651(A1) |
申请公布日期 |
2007.04.05 |
| 申请号 |
WO2006US37784 |
申请日期 |
2006.09.26 |
| 申请人 |
CABOT CORPORATION;WICKERSHAM, CHARLES, E.;HAAG, JASON |
发明人 |
WICKERSHAM, CHARLES, E.;HAAG, JASON |
| 分类号 |
C23C14/34 |
主分类号 |
C23C14/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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