Process to manufacture a semiconductor component with aperture cut through a dielectric material stack

摘要

In a process to manufacture a semiconductor component, an aperture is cut through a dielectric material stack formed over a metal zone. The metal zone has a conducting covering layer that forms a dielectric layered stack. The cover layer is etched through a first aperture, while the cover layer remains in place. The first aperture is then filled with a barrier material and a metal e.g. copper.