发明名称 PLASMA SURFACE TREATMENT METHOD AND DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma surface treatment method and a device which have a superior treatment efficiency with good productivity regardless of the material quality of a treating object without giving damage to the treating object under an atmospheric pressure. <P>SOLUTION: In the plasma surface treatment method, under atmospheric pressure or in the vicinity of the atmospheric pressure, a plasma generating gas heated up to a predetermined temperature is plasma excited in a reaction part 21 and the high temperature gas 15 containing the generated active species is moved to the surface of a treating object 16, and the surface of the treating object 16 is treated. Under the atmospheric pressure, regardless of the material quality of the treating object, and without giving a damage to the surface of the treating object, a plasma surface treatment is thereby carried out with superior treating efficiency and good productivity. A device using this plasma surface treatment method is also provided. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007087872(A) 申请公布日期 2007.04.05
申请号 JP20050277759 申请日期 2005.09.26
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OKAMOTO KATSUYA;OGATA SHIGEKI;NAKAJIMA KOJI
分类号 H05H1/24;H01L21/3065;H01L21/31 主分类号 H05H1/24
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