发明名称 |
Lateral interposer contact design and probe card assembly |
摘要 |
The present invention is directed to an interposer having an interposer substrate with an upper surface and a lower surface and at least one resilient contact element having an upper portion and a lower portion. The upper portion extends in a substantially vertical fashion above the upper surface of said interposer substrate, and the lower portion extends in a substantially vertical fashion below the lower surface of said interposer substrate. The upper and lower portions of the resilient contact element are substantially resilient in a direction parallel to the substrate.
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申请公布号 |
US2007075717(A1) |
申请公布日期 |
2007.04.05 |
申请号 |
US20060633324 |
申请日期 |
2006.12.04 |
申请人 |
TOUCHDOWN TECHNOLOGIES, INC. |
发明人 |
KINGHORN DAVID;GARABEDIAN RAFFI;YABUKI RICHARD;ISMAIL SALLEH |
分类号 |
G01R31/02 |
主分类号 |
G01R31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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