发明名称 Method for improving via's impedance
摘要 A method is for controlling an impedance of a via of a printed circuit board. The Via is connected with a trace and includes a drill hole, a pad and an anti-pad. The method includes steps of: building a math model; testing whether an impedance of the via matching with an impedance of the trace; analyzing the impedance of the via if passing the testing; and adjusting parameters of the pad, the anti-pad, and the drill hole if fails testing, and returning to the simulating step, till impedance matching achieved. The method which can efficiently keep signals integrality and increase signal transmission speed.
申请公布号 US2007074905(A1) 申请公布日期 2007.04.05
申请号 US20060392003 申请日期 2006.03.29
申请人 HON HAI PRECISION INDUSTRY CO., LTD. 发明人 LIN YU-HSU;YEH SHANG-TSANG;LI CHUAN-BING
分类号 H05K1/11;H01R12/04 主分类号 H05K1/11
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