| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting diode device which can prevent or reduce such deformations as the warps of its substrate and its resin layer and can increase its heat radiating quantity, and to provide a lighting apparatus. <P>SOLUTION: The light emitting diode device has a substrate 2 having a front surface, and having substrates 3 each of which has steps 3e, 3f, and having slits 6 interposed between the substrates, and has a resin layer 12 having a plurality of recesses 11 formed in the front surface of each substrate, and having via each slit engagements 12a2, 12b2 for covering therewith the steps of the rear surface of each substrate, and having spaces 12a3, 12b3 formed between the engagements and the rear surface of each substrate, and further, has each conductor layer 8a provided in each substrate, and moreover, has each light emitting diode chip 9 provided in each recess and connected electrically with each conductor layer. <P>COPYRIGHT: (C)2007,JPO&INPIT |
