| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide printed a wiring board with built-in electronic parts of which total thickness is small. <P>SOLUTION: The method to embed an electronic part in an insulating layer includes a step to remove an unnecessary part of a first layer of a supporting body comprised of at least a two-layer structure, a step to mount an electronic part to at least one of projections left in the first layer, a step to stack an insulating layer on the electronic part mounting surface, and a step to remove the second layer of the supporting body. The wiring board with built-in electronic parts is provided with an electronic part that is embedded by the method. <P>COPYRIGHT: (C)2007,JPO&INPIT |
