| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment capable of raising uniform heating in a substrate, uniforming an in-plane temperature distribution in the substrate treatment, and raising the uniformity of thickness in depositing a film. SOLUTION: A substrate treating device includes a treatment chamber 41 for treating the substrate 3, a support board 50 for supporting the substrate 3 inside the treatment chamber 41, and a heater 76 for heating the substrate 3 in the treatment chamber 41. A plurality of projections are arranged on the upper surface of the support board 50, and arrayed in a grid shape. The flatness of the upper surface of the support board is≤0.015 mm in a circumferential direction and≤0.025 mm in a radial direction. COPYRIGHT: (C)2007,JPO&INPIT |
