| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board capable of preventing flowing out of a solder into an adjoining wiring pattern. SOLUTION: A first printed wiring board 20 comprises a wiring pattern 21, and a solder layer 22 is applied on the upper end of the wiring pattern 21. A forked wiring pattern 31 is so formed on a second printed wiring board 30 as to engage with the wiring pattern 21 of the first printed wiring board 20. Recesses 34a and 34b are provided on inner walls 33a and 33b of the wiring pattern 31 on the second printed wiring board 30. So, a surplus solder flows into the recesses 34a and 34b to prevent the solder from flowing into an adjoining pattern even if solder supply is excessive. COPYRIGHT: (C)2007,JPO&INPIT
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