发明名称 MANUFACTURING METHOD OF METALLIC MATERIAL LAYER AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an easy manufacturing method of a metallic material layer or the like which hardly causes damage. SOLUTION: The manufacturing method of a metallic material layer has a process for forming a resist layer on a substrate, a process for forming a resist pattern by patterning the resist layer, a process for disposing an organic metallic solution on the substrate and on the resist pattern, a solvent removal process for removing solvent of the organic metallic solution, and a lift-off process for removing the resist pattern after the solvent removal process. According to this constitution, an easy manufacturing method of a metallic material layer or the like which hardly causes damage can be obtained. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007088205(A) 申请公布日期 2007.04.05
申请号 JP20050275177 申请日期 2005.09.22
申请人 TOKYO UNIV OF AGRICULTURE & TECHNOLOGY 发明人 ISHIBASHI TAKAYUKI;KAWADA TETSUYA
分类号 H01L39/24;H01L21/28;H01L21/3205 主分类号 H01L39/24
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