| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer inspection device which can prevent damage on a probe and a wafer by reducing a pre-heat time of the probe. SOLUTION: The device has a stage for heating or cooling a semiconductor wafer to a prescribed temperature by mounting the semiconductor wafer on an upper surface, a driving mechanism for driving the stage up and down, a probe card which is installed above the stage and has a probe needle for coming into contact with a bonding pad of the semiconductor wafer and transmitting a signal, a position control device which controls the driving mechanism for bringing the bonding pad of the semiconductor wafer into contact with the probe needle of the probe card, and a timing means for measuring elapsed time after the probe needle is brought into contact with the bonding pad. The position control device controls a position of the driving mechanism by adding a position correction value so that the bonding pad comes into contact with the probe needle by a prescribed strain amount, based on the prescribed temperature for inspecting the semiconductor wafer and the elapsed time after the probe needle is brought into contact with the bonding pad. COPYRIGHT: (C)2007,JPO&INPIT
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