发明名称 |
Carrier tape and heat shrinking cover tape for integrated circuit devices |
摘要 |
Disclosed are embodiments of a carrier medium for integrated circuit die (or other components). The carrier medium may include a carrier tape and a heat shrinkable cover tape, the carrier tape including a number of spaced-apart die retaining areas along the length of this tape. Other embodiments are described and claimed.
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申请公布号 |
US2007074996(A1) |
申请公布日期 |
2007.04.05 |
申请号 |
US20050243808 |
申请日期 |
2005.10.05 |
申请人 |
NICE TRAVIS S;SHAHIDI NIMA;CONTES ANDREW N;CAREY DAVID A |
发明人 |
NICE TRAVIS S.;SHAHIDI NIMA;CONTES ANDREW N.;CAREY DAVID A. |
分类号 |
B65D85/00 |
主分类号 |
B65D85/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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