发明名称 System and method for compensating for thermal expansion of lithography apparatus or substrate
摘要 To prevent a substrate from expanding significantly to generate overlay errors an exposure operation takes place in two parts. A first part exposes boundary areas and a second part exposes the larger, bulk areas. In one example, a portion of the substrate is fixed and the substrate is exposed progressively from parts furthest from the fixed portions towards the fixed portion. In another example, a plurality of high velocity scans take place instead of a single slow scan, and the substrate is allowed to cool between the high velocity scans. In another example, a lithographic apparatus is heated in order to maintain a temperature differential between the apparatus and the surrounding environment, and to minimize any fluctuation due to the exposing radiation.
申请公布号 US2007075315(A1) 申请公布日期 2007.04.05
申请号 US20050257398 申请日期 2005.10.25
申请人 ASML NETHERLANDS B.V. 发明人 VENEMA WILLEM J.;BASELMANS JOHANNES J.M.
分类号 H01L29/04;H01L21/00;H01L21/84;H01L29/15;H01L31/036 主分类号 H01L29/04
代理机构 代理人
主权项
地址