| 发明名称 |
METHOD OF RESTORING LOW-K MATERIAL OR POROUS LOW-K LAYER |
| 摘要 |
A method of restoring a low-k material is described, applied to a substrate with a low-k material thereon, wherein the substrate has been subject to a previous process that raised the k-value of the low-k material. The method includes performing a plasma treatment to the low-k material to decrease the k-value thereof.
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| 申请公布号 |
US2007077751(A1) |
申请公布日期 |
2007.04.05 |
| 申请号 |
US20050163051 |
申请日期 |
2005.10.03 |
| 申请人 |
CHEN MEI-LING;CHEN JEI-MING;LAI KUO-CHIH;SU WEN-CHIEH |
发明人 |
CHEN MEI-LING;CHEN JEI-MING;LAI KUO-CHIH;SU WEN-CHIEH |
| 分类号 |
H01L21/4763 |
主分类号 |
H01L21/4763 |
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