Semiconductor device for radio frequency applications and method for making the same

摘要

A semiconductor device ( 5 ) for radio frequency applications has a semiconductor chip ( 1 ) with an integrated circuit accommodated in a radio frequency package. Inside bumps ( 2 ) comprise inside contacts between the semiconductor chip ( 1 ) and a redistribution substrate ( 3 ). The inside bumps ( 2 ) have a metallic or plastic core ( 6 ) and a coating layer ( 7 ) of a noble metal.