| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a packaging device in which, when a semiconductor chip is packaged on a board, packaging conditions such as a sequence of capturing an image of the board and the semiconductor chip and a timing of supporting the board can be set. <P>SOLUTION: The packaging device comprises a conveying means 23 for conveying and positioning the board; a packaging stage 20 which is provided on the lower side of the board positioned by the conveying means, for supporting the lower face of the board by lifting up; a packaging tool 49 for packing the semiconductor chip on the upper face of the board which has the lower face supported by the packaging stage; first and second cameras 32, 33 for capturing an image of the board and the semiconductor chip to position the board and the semiconductor chip, based on positional recognition depending on the captured image; and a controller 39 for controlling a sequence of recognizing the board and the semiconductor chip in position by the first and second cameras, and a timing of supporting the lower face of the board by lifting the packaging stage up depending on settings to package the semiconductor chip on the board. <P>COPYRIGHT: (C)2007,JPO&INPIT |
