发明名称 On-chip capacitor structure
摘要 A first capacitor is formed on a substrate and connected to a first differential node of a differential circuit, and a second capacitor is formed on the substrate and connected to a second differential node of the differential circuit. A third capacitor is connected between the first differential node and the second differential node, and is formed at least partially above the first capacitor. In this way, a size of the first capacitor and/or the second capacitor may be reduced on the substrate.
申请公布号 US2007075397(A1) 申请公布日期 2007.04.05
申请号 US20050241142 申请日期 2005.09.30
申请人 BROADCOM CORPORATION 发明人 ZHANG BO
分类号 H01L29/00 主分类号 H01L29/00
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