PROCESS FOR PRODUCING WIRING BOARD, AND WIRING BOARD

摘要

This invention provides a process for producing wiring board and a wiring board that can realize highly efficient heat radiation and the like. In the production process of a wiring board, a clad material comprising two or more layers of two or more types of metals including electrically conductive first and second metals stacked on top of each other is etched to form a columnar part (16) comprising a second metal (12) on a first metal plate part (11). Next, an insulating resin material is stacked on the plate part (11) for covering the columnar part (16) to form an insulating resin layer (17). The surface of the insulating resin layer (17) is then polished so that the front end of the columnar part (16) is exposed from the insulating resin layer (17). A metal layer (18) for a wiring layer formed of an electrically conductive metal connected to the columnar part (16) is provided on the columnar part (16) on its side remote from the plate part (11).