| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a sputtering method for forming thin films having good film quality on a large-area substrate and a substrate holder suitable for this sputtering method. SOLUTION: The substrate transported to this device by a substrate transporting robot is placed on a substrate holding plate 3 and is clamped at the time of arranging a target nearly perpendicularly in a film forming chamber, disposing this target opposite to the substrate and sputtering the target. The substrate is then erected together with the substrate holding plate 3 and is disposed to face the target. Since the films are formed by installing the substrate perpendicularly, there is no falling of dust on the substrate surface. In such a case, the useless movements of the substrate transporting robot are eliminated if the substrate holding plate 3 is provided with a mechanism for temporary placement of the substrate and the substrate with which the film formation ends and the substrate not formed with the films yet are exchanged. The heating of the substrate at the time of sputtering is made possible if the substrate holding plate is provided with the heater and, therefore, the thin films having the good crystallinity are formed without the occurrence of warpage and distortion.</p> |
