发明名称
摘要 PROBLEM TO BE SOLVED: To form a highly crystalline silicon film on a substrate having an insulating surface by using metal elements that promote the crystallization of silicon, and performing heat treatment at high temperature in order to obtain the crystalline silicon film. SOLUTION: A silicon oxide film 102 and an amorphous silicon film 103 are formed on a quartz substrate 101 in this order. The surface of the amorphous silicon film 103 is held in contact with nickel elements, and heat treatment is performed at a temperature of 800-1100 deg.C to reform the amorphous silicon film 103 into a crystalline silicon film 106. This makes it possible to obtain the crystalline silicon film 106 in as short a time as four hours or so, and provides the crystalline silicon film 106 with high crystallinity. That makes it possible to disperse in the film, the nickel elements that contributed to the promotion of crystallization, and prevents a high-density trap level from being locally formed.
申请公布号 JP3901903(B2) 申请公布日期 2007.04.04
申请号 JP20000034524 申请日期 2000.02.14
申请人 发明人
分类号 H01L21/20;H01L21/336;H01L21/02;H01L27/12;H01L29/786 主分类号 H01L21/20
代理机构 代理人
主权项
地址