Method for producing a radiation emitting device and radiation emitting device

摘要

The method involves providing a housing body and a carrier for a radiation emitting semiconductor body, where the carrier is produced in a powder injection molding process from a molding compound (34) that contains a metal. The molding compound for the carrier is fed into an injection mold (36). A binder, auxiliary agents and flowable compound are obtained when the molding compound is heated or compressed. An independent claim is also included for a radiation emitting component comprising a housing body.