Heatsink Assembly

摘要

A heatsink assembly having a simple structure for coupling a heatsink (120) and an electronic chip is provided with a heatsink (120) which contacts a heat source (110) mounted on a substrate (100) and absorbs heat generated from the heat source (110); and a pressing member (130) which is coupled to the substrate (100) and comprises: a pressing cover (131) for pressing the heatsink (120) so that the heatsink (120) can be secured to the heat source (110); and tension parts (133) which extend from the pressing cover (131) and exert a pressing force onto the pressing cover (131), when being coupled to the substrate (100).