| 摘要 |
PROBLEM TO BE SOLVED: To obtain an inexpensive device wherein reliability is improved, a circuit sealing frame is not used, a cubic substrate with high dimension accuracy, the cost reduction and the yield rate of the product are improved, and the luminance performance is increased furthermore. SOLUTION: On an insulating substrate 1 wherein an LED-element containing concave part 12 is formed and the solid made of epoxy resin is molded, a pair of upper surface electrodes 2a and 2b, lower-surface electrodes 3a and 3b and side-surface electrodes 4a and 4b connected to the upper and lower-surface electrodes are formed. An LED element 5 is fixed on one upper surface electrode 2a. A bonding wire 6 is connected to the other upper surface electrode 2b. Sealing is performed with sealing resin 8 comprising the epoxy resin. At the bottom surface and the slant surfaces at four surfaces expanding upward, a light reflecting dummy pattern is applied in a vacant space which does not interfere with the upper surface electrodes 2a and 2b, and the upward rising of luminance is achieved. Both the insulating substrate 1 and the sealing resin are epoxy resin, and the linear expansion coefficients agree. Therefore, the separation of the substrate 1 and the resin 8 does not occur. There is no worry of the damage to the LED element 5. Thus, the highly reliable and inexpensive surface- mount chip is obtained. |
