| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for measuring a solder height for easily and accurately measuring the solder height of a connected part of a mounting component which cannot be visually confirmed in a mounting board constituted of the mounting component containing a plurality of elements. <P>SOLUTION: An image processing unit 5 sets an area to be processed of a quadrilateral shape including an area abc for passing a spherical solder 2c to a transmitted image which transmits a material to be measured with an X-ray, and forms a cut-out image (step S12). The unit 5 calculates a mean image luminance Dm at a periphery of the region abc (step S16), sets a measuring line L and measuring positions L<SB>0</SB>to L<SB>n</SB>(step S17), and then calculates a height Hh<SB>x</SB>by using the image luminance of each to the positions L<SB>0</SB>to L<SB>n</SB>and an attenuation coefficient of the solder (step S19). The unit 9 then detects the maximum value from the heights Hh<SB>0</SB>to Hh<SB>n</SB>as the maximum height Hh<SB>max</SB>of the solder 2c (step S22). <P>COPYRIGHT: (C)2003,JPO |
