| 摘要 |
PROBLEM TO BE SOLVED: To improve properties of bonding between a light-emitting semiconductor device and a substrate by shaping a pair of external electrodes on the substrate in a convex form in face-to-face relation wherein the electrodes, respectively, have a smaller surface area as they come closer to each other, so as to have a space into which a molding member can readily flow. SOLUTION: An n-type semiconductor and a p-type semiconductor are successively formed, followed by etching a portion of the p-type semiconductor to expose the surfaces of the individual n- and p-type semiconductors made of gallium nitride based compound. Electrodes 113 are formed on the exposed surfaces of the semiconductors, thereby forming a light-emitting semiconductor device having the electrodes 113 at the same plane side. On the other hand, a copper plate is folded to form external electrodes 101 on a substrate. The external electrodes 101, which are facing each other, are shaped in a convex form so that the electrodes, respectively, have a smaller surface area when they come closer to each other. After applying a silver paste to the external electrodes 101, positional adjustment is performed relative to the individual electrodes 113 of the light-emitting semiconductor device, followed by die bonding. In this way, a molding members can readily enter into a space between the substrate and the light-emitting semiconductor device, thereby improving bonding properties theebetween. |
