| 摘要 |
<p>An electronic component mounting method of mounting an electronic component provided with a lead wire (60) on a printed wiring board (10), comprises printing a cream solder (50) on a through hole (20) to which the lead wire (61) of the electronic component provided with the lead wire (60) inserted, inserting the electronic component provided with the lead wire (60) into the through hole (20) on which the cream solder (50) has been printed, and soldering the lead wire (61) of the electronic component provided with the lead wire (60) inserted into the through hole (20) onto the through hole (20).
</p> |
