发明名称 |
Interconnect routing over semiconductor for editing through the back side of an integrated circuit |
摘要 |
Circuit edits may be performed through the back side of an integrated circuit die. In one embodiment, a circuit edit is achieved by exposing first and second circuit edit connection targets through a semiconductor substrate of the integrated circuit die from the back side. An insulating layer is not deposited over the first and second circuit edit connection targets and the exposed semiconductor substrate. Next, a conductor is deposited over the circuit edit connection targets from the back side of the integrated circuit to couple together the circuit edit connection targets.
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申请公布号 |
US7199039(B2) |
申请公布日期 |
2007.04.03 |
申请号 |
US20030440999 |
申请日期 |
2003.05.19 |
申请人 |
INTEL CORPORATION |
发明人 |
SUTHAR SAILESH C.;HACK PAUL J.;SARWAR SYED N. |
分类号 |
H01L21/4763;G01R31/317;H01L21/48;H01L23/58 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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