发明名称 Carbon-phenol resin molding compound
摘要 A carbon-phenol resin molding compound is provided, which is preferably used to obtain molded articles having high electrical and thermal conductivities as well as good mechanical strength. The resin molding compound is prepared by reacting a phenol with an aldehyde in the presence of a catalyst, while mixing them with a carbon powder such that a content of the carbon powder in the molding compound is 75 wt % or more. The catalyst is at least one selected from tertiary amines, carbonates, hydroxides and oxides of alkali metals or alkali earth metals.
申请公布号 US7199186(B2) 申请公布日期 2007.04.03
申请号 US20020211381 申请日期 2002.08.05
申请人 NIPPON PILLAR PACKING CO., LTD. 发明人 IDE ISAMU;NISHIKAWA MASANOBU;HIGUCHI HISATO;YOSHIDA TSUNEMORI;SUGITA KATSUNORI
分类号 B60C1/00;C08G8/10;C04B26/12;C08G8/00;C08J3/00;C08K3/04;C08L61/04;C08L61/06 主分类号 B60C1/00
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