发明名称 HEAT SINK
摘要 Provided is a heatsink, including a cooling zone (Z) to contact an object (40) to be frozen and having microchannels (35) formed therein to define a plurality of fluid pathways, an inlet (A) through which a working fluid enters, a distributor (B), interposed between the inlet (A) and the cooling zone (Z), to uniformly distribute the working fluid introduced through the inlet (A) to the microchannels (35), an outlet (F) through which the working fluid, passing through the cooling zone (Z), exits, and a collector (E), interposed between the cooling zone (Z) and the outlet (F), to collect the working fluid passing through the microchannels (35).
申请公布号 KR20070036308(A) 申请公布日期 2007.04.03
申请号 KR20050091197 申请日期 2005.09.29
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, HEE SUNG;KIM, SUN SOO
分类号 H01L23/36 主分类号 H01L23/36
代理机构 代理人
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