发明名称 Slotted substrates and methods and systems for forming same
摘要 Methods and systems for forming compound slots in a substrate are described. In one exemplary implementation, a method forms a plurality of slots in a substrate. The method also etches a trench in the substrate contiguous with the plurality of slots to form a compound slot.
申请公布号 US7198726(B2) 申请公布日期 2007.04.03
申请号 US20030643290 申请日期 2003.08.19
申请人 发明人
分类号 B41J2/16;B41J2/175;B41J2/14 主分类号 B41J2/16
代理机构 代理人
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