| 摘要 |
PURPOSE: A semiconductor package including a lead frame with a solder ball groove and a stacked package using the same are provided to improve connection reliability between a lead and a solder ball and prevent a crack of the solder ball. CONSTITUTION: A lead frame(12) is fabricated by using a raw material for lead frame. A lead frame(12) includes a chip loading portion(12a) and a lead portion(12b). The chip loading portion(12a) and the lead portion(12b) have projection portions, respectively. A hemispheric groove(13) is formed at an outside of the lead portion(12b) by using an etching method. The hemispheric groove(13) is used as a solder ball groove. A semiconductor chip(14) is adhered to the chip loading portion(12a) of the lead frame(12). The semiconductor chip(14) is connected with the lead portion(12b) by using a metal line(15). A package body(16) is formed by a molding process. A solder ball(17) is adhered to the hemispheric groove(13) of the lead frame(12). |
