Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

摘要

A method of manufacturing a semiconductor device includes (a) interposing an adhesive between a surface of a substrate on which an interconnect pattern is formed and a surface of a semiconductor chip on which electrodes are formed; and (b) applying pressure between the semiconductor chip and the substrate, and covering with the adhesive at least a part of lateral surfaces of the semiconductor chip that is perpendicular to the surface of the semiconductor chip on which the electrodes are formed.