| 摘要 |
A conductive silver paste according to the present invention comprises epoxy resin, flake-shaped silver powders having an average particle diameter of 0.5 to 50 mum, and spherical silver powders, each having its surface coated with organic matter, having an average particle diameter of not more than 1 mum, and a conductive film according to the present invention is formed by printing or applying the conductive silver paste on a surface of a base material, followed by drying, and then thermosetting the epoxy resin.
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