| 摘要 |
A lead frame for a semiconductor package and a manufacturing method thereof are provided. In the lead frame, a Ni plating layer made of Ni or a Ni alloy is plated on a base metallic layer. A Ni-Pd plating layer made of a Ni-Pd based alloy and having a Ni atomic concentration in a range of about 60% to about 95% is plated on the Ni plating layer, and a protective plating layer is plated on the Ni-Pd plating layer. |
