| 摘要 |
One embodiment of the present invention provides a system that facilitates capacitive inter-chip communication. During operation, the system first determines an alignment between a first semiconductor die and a second semiconductor die. Next, electrical signals are selectively routed to at least one interconnect pad in a plurality of interconnect pads based on the alignment thereby facilitating communication between the first semiconductor die and the second semiconductor die. The plurality of interconnect pads can include transmitting pads, receiving pads, and transmitting and receiving pads. The alignment may be determined continuously or at times separated by an interval, where the interval is fixed or variable. Several variations on this embodiment are provided.
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