| 发明名称 |
Method and system for controlling the chemical mechanical polishing by using a seismic signal of a seismic sensor |
| 摘要 |
In a system and a method according to the present invention, a seismic signal from a seismic sensor coupled to a drive assembly of a pad conditioning system is used to estimate the status of one or more consumables in a CMP system.
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| 申请公布号 |
US7198542(B2) |
申请公布日期 |
2007.04.03 |
| 申请号 |
US20040987804 |
申请日期 |
2004.11.12 |
| 申请人 |
ADVANCED MICRO DEVICES, INC, |
发明人 |
KRAMER JENS;GYULAI THOMAS;REICHEL ARWED |
| 分类号 |
B24B49/10;B24B37/04;B24B49/00 |
主分类号 |
B24B49/10 |
| 代理机构 |
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