| 摘要 |
In an arrangement for determining a temperature loading during a soldering process, a semiconductor chip ( 1 ) comprises at least one contact ( 2 ) to be soldered or is electrically conductively connected to at least one contact ( 14 d) to be soldered that is situated outside the semiconductor chip. The semiconductor chip ( 1 ) furthermore comprises a temperature sensor device ( 3 ), which determines a measurement quantity corresponding to the temperature. A processing device ( 4, 5 ) has an analog-to-digital converter ( 5 ), which is electrically conductively connected to the temperature sensor device ( 3 ) and converts the measurement quantity into at least one storable signal that represents the temperature loading. A voltage supply device ( 10 ), which is electrically conductively connected to the temperature sensor device ( 3 ) and the processing device ( 4, 5 ), supplies these components with an operating voltage. A data memory ( 6 ) serves for storing the at least one storable signal. An electrical line ( 7, 11 ) connected to the data memory ( 6 ) serves for outputting the stored signal. As a result, it is possible to monitor temperature loadings of the semiconductor chip also outside the sphere of influence of the semiconductor manufacturer.
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