| 发明名称 |
Integrated circuit configuration comprising a sheet-like substrate |
| 摘要 |
An integrated circuit is formed on a non-planar substrate. The integrated circuit is formed over a plurality of layers. Chemical or physical changes in the microstructure of the substrate cause the bending of the substrate, in one or more propagation directions.
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| 申请公布号 |
US7199448(B2) |
申请公布日期 |
2007.04.03 |
| 申请号 |
US20030641264 |
申请日期 |
2003.08.14 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
JANKE MARCUS;LAACKMANN PETER |
| 分类号 |
H01L21/52;H01L29/06;H01L23/13;H01L23/58 |
主分类号 |
H01L21/52 |
| 代理机构 |
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