| 摘要 |
The present invention relates to a thin film circuit board device having passive elements in wiring layers. The thin film circuit board device includes a base board ( 2 ) and a circuit part ( 3 ) including insulating layers ( 11 ) and ( 16 ) and pattern wiring ( 14 ) and ( 17 ) formed on a build-up forming surface ( 2 a). On the first insulating layer ( 11 ), a receiving electrode part ( 21 ) is formed and the passive elements electrically connected to the receiving electrode part ( 21 ) are formed. In the circuit part ( 3 ), a substrate titanium film and a substrate film are laminated so as to cover the receiving electrode part ( 21 ) and the passive elements respectively. The substrate film and the substrate titanium film in areas in which a metallic film is not formed are etched through the metallic film serving as the first pattern wiring ( 14 ) formed on the substrate film as a mask. Thus, a substrate layer ( 23 ) and a substrate titanium layer ( 22 ) are formed. Consequently, the substrate titanium film serving as the substrate titanium layer ( 22 ) prevents the corrosion of the receiving electrode part and the respective passive elements due to etching liquid to form the passive elements with high performance.
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