| 摘要 |
A camera module package using a flip-chip type image sensor module is provided. The camera module package includes: a lens barrel in which a plurality of lenses are stacked and mounted; a housing having an upper opening into which the lens barrel is inserted and mounted; and an image sensor module. The image sensor module includes an image sensor to which bumps are bonded on electrode pads formed on one side; a flexible printed circuit board (FPCB) having via holes formed at positions corresponding to the pads of the image sensor, and conductive patterns formed between layers in which the via holes are formed; and a conductive adhesive filled in the via holes. Accordingly, in manufacturing the COF type image sensor image module, the flip-chip bonding can be achieved only using the conductive adhesive inside the via hole without ACF or NCP, attributing to the microstructure of the camera module. Furthermore, because the relatively expensive ACF or NCP is not used, the camera module can be manufactured at a low cost. |
